(Australia-NewsWire.Com, January 19, 2018 ) Key points like Improving Performance and maintaining high package density, increasing the reliability of circuits & thriving IoT markets are driving the markets, while the factors like high cost associated with initial implementation and less available options for customization are hindering the growth of flip technology markets.
Flip Chip is technology or controlled collapse chip connection which is used to interconnect the semiconductor chips such as IC chips, microdevices, microprocessors and micro sensors. Greater I/O flexibility, higher performance, and smaller size are the advantages of the flip chip technology over the different technologies used in the context of semiconductors. There are most advanced packaging solutions being served by new solutions so these markets are expected to meet the new challenges and adapt the competitive environment.
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